• WSA:  Introduction to GaN MMIC Design
• WSB: Advancements and Challenges Toward Radio-in-Package and Radio-on-Chip
• WSC: Imaging at mm-Wave and Beyond
• WSD: Re-configurability Requirements for Multi-Standard Low-Power Operation
• WSE: Advancements in Linear Power Amplifiers for Cellular Infrastructure
• WSF: EMI Compliant Product Design Practices: Interference Analysis, Floorplanning, Grounding Strategies, Chip-Package-Board Co-Design
• WSG: New Architectures for Digitized Receivers
• WSH: Design for Manufacturability and Self-Testability of RFICs
• WSI:  RF Bio-Medical Electronics and Sensors
• WSJ: Systems & Circuits for Sensing, Co-Existence, and Interference Mitigation in SDR and Cognitive Radios
• WSK: Efficiency Enhancement Techniques of Power Amplifiers and Transmitters for Mobile Applications

8:00 AM – 5:20 PM
WSA:  Introduction to GaN MMIC Design

Organizers:    Bernie Geller, Vadum, Inc.
                          Ed Niehenke, Niehenke Consulting
                          Rüdiger Quay, Fraunhofer Institute
                          Tim Lee, The Boeing Company

Abstract:  This workshop will cover the important and current topic of RF GaN MMIC Design. Workshops in previous years have addressed GaN technology in general, including basic material characteristics, reliability issues, packaging issues, and system implications. This workshop will be educational in nature, with significant time allotted for audience questions and participation. In addition to the usual Q&A time after each talk, we are planning to have an open panel session at the end of the day in which all of the speakers will participate and answer questions from the audience. We encourage attendees to bring questions, design issues, and design hints that they would like to share.
The first presentation will provide an overview of GaN MMIC design, focusing on similarities and differences in the design process between GaAs and GaN MMICs. This will be followed by papers addressing specific designs for radar and communications systems, mm-Wave applications, and “passive” applications such as high power RF switches. The afternoon session will start with a paper discussing issues related to the design and layout of passives and GaN MMICs at mm-Wave frequencies, followed by a paper discussing GaN MMIC processing options and circuit simulation techniques. The final presentation will provide an overview of current non-linear models for GaN devices, including similarities (and differences) with GaAs models and areas where new models are needed.

Speakers:

• Thomas Winslow, M/A-COM Technology Solutions, “An Overview of GaN MMIC Design”
• Bill Pribble, Cree RF and Microwave Products, “GaN MMIC Design for Radar and Communications Applications”
• James Schellenberg, QuinStar Technology, Inc., “mm-Wave GaN Power MMICs: Design and Status”
• Charles F. Campbell, TriQuint Semiconductor, “High Power Switch MMIC Design with Gallium Nitride Transistors”
• Rüdiger Quay, Fraunhofer Institute of Applied Solid-State Physics (IAF), “Design, Layout, and Modeling of mm-Wave GaN Passives and MMICs”
• Harris (Chip) Moyer, HRL Laboratories, “GaN MMIC Technology and Circuit Simulation Techniques”
• Walter R. Curtice, W. R. Curtice Consulting, “Status of Linear and Nonlinear GaN Modeling for MMICs”

8:00 AM – 5:20 PM
WSB: Advancements and Challenges Toward Radio-in-Package and Radio-on-Chip

Organizers:    Kenjiro Nishikawa, NTT Corporation
                          Noriharu Suematsu, Tohoku University
                          Pierre Busson, ST Microelectronics
                          Eric Kerherve, IMS Laboratory

Abstract: Advanced wireless communication systems require multi-functionality and miniaturization of their modules, irrespective of frequency or system.  A recent development trend is how we can integrate complete functions on a chip or in a package to achieve a real “radio-in-package” or “radio-on-chip”.  A design challenge of integrated antennas is the most interesting issue. This workshop will focus on design innovations of radio-in-package/radio-on-chip and the evaluation methods of highly integrated system-in-package/system-on-chip with antennas. Presentation topics will cover integrated antenna design techniques, measurement and evaluation techniques for fully-integrated mm-Wave system-in-package/system-on-chip, reduction of crosstalk and interference, power management techniques of chip/package for phased-array systems, and thermal management techniques of chip/package for phased array system.

Speakers:

• Gabriel Rebeiz, UCSD, “mm-Wave Wafer-Scale Phased Arrays and System-on-Chip”
• Sorin Voinigescu, University of Toronto, “D-Band Radio and Imaging Transceivers with On-Die Antennas”
• Aydin Babakhani, Rice University, “Large-Scale Radiating ICs”
• Byunghoo Jung, Purdue University, “The Role of Wireless Inter- and On-Chip Links in Future SoC”
• C. Patrick Yue, UCSB,  “Fully Integrated Transmitters with Embedded Antenna for On-Wafer Wireless Testing”
• Yongxin Guo and Fujiang Lin, National University of Singapore, “New Developments in On-Chip Antennas and Antenna-in-Package for 60-GHz Applications”
• Noriharu Suematsu, Tohoku University, “A 60-GHz Ultra Small RF Module with Antenna using 3-D SiP Technology”
• Tomohiro Seki, NTT Corporation, “mm-Wave System-in-Package Technology”
• Romain Pilard, STMicroelectronics France, “System-in-Package Integrated Antennas in Industrial and Prospective Packages for mm-Wave Applications”
• Yoshimasa Sugimoto, Kyocera Corp., “Ceramic Package with Antenna for 60-GHz WPAN Application”
• Dong G. Kam and Scott Reynolds, IBM, “Low-Cost Antenna-in-Package Solutions for 60-GHz Phased-Array Systems”

8:00 AM – 5:20 PM
WSC: Imaging at mm-Wave and Beyond

Organizers:    Arun Natarajan, IBM T. J. Watson Research Center
                          Fujiang Lin, University of Science and Technology of China
                          Payam Heydari, University of California, Irvine

Abstract:  Advances in device technologies are making mm-Wave imagers both technologically viable and commercially attractive. These imagers are now targeting exciting applications that capitalize on the unique characteristics of the mm-Wave spectrum.  This workshop will present recent developments in mm-Wave imaging, focusing on imagers for security, spectroscopy and clinical diagnosis. Speakers will address the different specifications, architectures and technology tradeoffs for such applications and present passive and active imagers in III-V as well as CMOS device technologies.

Speakers:

• Albert Pergande, Lockheed Martin, “The History and Challenges of Passive mm-Wave Imaging”
• Jonathan Lynch, Hughes Research Lab, “III-V based W-band Sensors for Passive mm-Wave Imaging”
• Arttu Luukanen, VTT Technical Research Centre of Finland, “Passive and Active Sub-mm-Wave Imaging for Stand-Off Security Screening Applications”
• Frank De Lucia, Ohio State University, “Electronic Approaches to Sensor Applications in the THz Spectral Region:  The Intersection of Physics and Technology”
• Kenneth K. O, University of Texas, Dallas, “Millimeter and Sub-mm-Wave Imaging and Spectroscopy in CMOS”
• Adrian Tang and Frank Chang, University of California, Los Angeles, “Advantages of CMOS Receivers for Millimeter and Sub-mm-Wave Imaging”
• Mikael Persson, Chalmers University of Technology, “Clinical Systems for Microwave Imaging and Diagnostics and Treatment”
• Fujiang Lin, University of Science and Technology of China, “mm-Wave Therapy (MWT): Histories and Status”

8:00 AM – 5:20 PM
WSD: Re-configurability Requirements for Multi-Standard Low-Power Operation

Organizers:    Gernot Hueber, NXP Semiconductor, Austria
                          R. Bogdan Staszewski, TU Delft, The Netherlands
                          Stefan Heinen, RWTH Aachen University, Germany

Abstract: Advances in fabrication technology have enabled the use of (Bi) CMOS in today’s RF transceivers for wireless communications. Multi-band and multi-mode radios covering the diversity of communication standards from 2G GSM, 3G UMTS, to 4G LTE and LTE-advanced as well as WLAN, BT, and GPS impart unique challenges on RF transceiver design due to limitations of reconfigurable components that must meet demanding cellular performance criteria at costs that are attractive for mass market applications. For base-stations’ first steps towards reconfigurability, the excessive usage of compound technologies needs to be changed into the use of Si-based circuit technologies to enable integration. Although integration features the possibility for implementing a significant computational power and complex functionality directly on a single IC, it shows poor performance in RF circuits compared to other technologies. The focus of this workshop will be on the challenges and requirements that the wireless standards place on future multi-radio operation, along with a thorough discussion of advanced techniques for receivers and transmitters leading towards integration in a low-power multi-radio SoC or SiP for terminals and base-stations. Approaches include novel architectures, highly configurable analog circuitry, digitally assisted and enhanced analog/RF modules and the integration of digital signal processing into the traditionally purely analog front-end.

Speakers:

• Jan Cranickx, IMEC, Leuven, Belgium, “SAW-less Radio Transceivers in 40nm CMOS”
• Earl McCune, Highspeed and Wireless, CA, “Unifying PA Approaches for Multi-Standard Low-Power Operation”
• Art Morris, WiSpry, Irvine, CA, “High-Performance Digitally Reconfigurable RF Front Ends”
• Larry Larson, Universiy of California, San Diego, CA, “Low-Power Multi-Standard Transmitters in Nanoscale CMOS”
• Domine Leenarts, NXP, The Netherlands,  “Base stations: The First Steps Towards Re-configurability”
• Hooman Darabi, Broadcom Corporation, Irvine, CA, “Open-Loop Polar Transmitters for Cellular Application”
• R. Bogdan Staszewski, TU Delft, The Netherlands, “Recent Advancements and Future Directions in Digital RF and Digitally-Assisted RF”
• Ranjit Gharpurey, University of Texas, TX, “Linearity enhancement techniques for Multi-Standard Radio Systems”
• Walid Ali-Ahmad, MediaTek, "Towards reconfigurable multi-standard multi-band radios: key system issues and architecture concepts"

8:00 AM – 5:20 PM
WSE: Advancements in Linear Power Amplifiers for Cellular Infrastructure

Organizers:    Joseph Staudinger, Freescale Semiconductor, Inc.
                          David Runton, RFMD, Inc.
                          Freek van Straten, NXP

Abstract:  Cellular infrastructure equipment market forces are demanding improvements in power amplifier performance in terms of power, efficiency and linearity for increasingly wider bandwidth signals. This challenge is being addressed with research and advancements on several fronts, including device technology (Si LDMOS, GaAs HBT, GaN), PA circuit architecture (Doherty circuits and high power ICs), and more effective PA linearization techniques.  This workshop will feature experts detailing their solutions to these complex issues and sharing their insight of future research activities.

Speakers:

• John Gajadharsing, NXP, “Recent Advances in Doherty PAs”
• Margaret Szymanowski, Freescale Semiconductor, Inc., “Advances in High Power LDMOS Integrated Circuit Amplifiers”
• Craig Steinbeiser and Oleh Krutko, TriQuint Semiconductor, “High Power GaAs HVHBT Power Amplifiers”
• Christopher Burns, RFMD, “Advancements in GaN Technology “
• Roland Sperlich, Texas Instruments, “Linearization Trends for Wireless Infrastructure PAs”

8:00 AM – 5:20 PM
WSF: EMI Compliant Product Design Practices: Interference Analysis, Floorplanning, Grounding Strategies, Chip-Package-Board Co-Design

Organizers:    Rick Janssen, NXP Semiconductors
                          Vivek Bhan, Fujitsu Microelectronics America Inc.
                          Oren Eliezer, Xtendwave

Abstract:  With the integration of RF, mixed signal and digital building blocks on a single die, combined with the trend to go to higher frequencies to accommodate for higher data rates, it is essential to consider various on-chip coupling effects in the early design phases of the RFIC.
Additionally, provisions should be made at the application level by reducing the impact of peripheral interactions (between chip, package, board, antenna, etc.), as well as the potential for self-interference, such that these are either eliminated or can be resolved on the fabricated product in order to reduce the number of re-spins.
The focus of this interactive workshop will be on preventing EMI problems by applying a number of measures in the early design phase: interference analysis, coupling-aware RFIC floor planning, grounding strategies, chip-package-board co-design practices, frequency planning, clock generation strategies, and modeling and CAD/EDA capabilities to address coupling effects.  Recognized Experts in the semiconductor industry will present actual issues encountered in their designs and the solutions/design practices that can be used to address such issues in the early design phase.  Interactive discussions will be facilitated to exchange valuable ideas for the benefit of participants and the semiconductor industry at large.

Speakers:

• Vivek Bhan, Fujitsu Microelectronics America, Inc., “Signal Isolation in a 2G/3G/4G Multimode Cellular Transceiver with Digital Interface”
• Christian Stockreiter, Austriamicrosystems AG, “Simulation of Electromagnetic Interference from ICs Experienced during System Level EMC Tests”
• Jan Niehof, NXP Semiconductors, “Optimal RFIC Floorplanning and Grounding Strategies”
• Oren Eliezer, Xtendwave, “Fundamentals of Self-Interference Analysis and Prevention in Complex RF SoCs”
• HeeSoo Lee1, Yi Cao2, Wenjun Shi2, 1Agilent Technologies, 2RIM, “The Effect of Digital Noise on RF Receiver Sensitivity in Modern Smart-Phones Applications”
• Davide Pandini, STMicroelectronics, “Electromagnetic Interference Reduction on an Automotive Microcontroller”
• Ram Sadhwani , Intel, “Radio Co-existence Challenges in Multi-Comm SoCs”

8:00 AM – 5:20 PM
WSG: New Architectures for Digitized Receivers

Organizers:    Didier Belot, ST Microelectronics - Crolles
                          Julien Ryckaert, IMEC

Abstract:  The recent growth of circuit techniques that leverage the high speed capabilities of deep submicron CMOS devices is gradually renovating the architectures of RF communication systems. The high speed resources of digital circuits allow a redistribution of wireless transceiver functionality among the analog and digital domains.  In a receiver, this trend leads to a complete repositioning of the analog to digital conversion and a reassessment of the classical analog signal conditioning that precedes it.  Aiming at highly digitized receiver architectures, several disruptive techniques have recently been proposed to reach this paradigm shift as will be presented in this workshop.  Today, most techniques use RF bandpass quantization noise shaping inside the ADC to improve its resolution at RF. They use either LC bandpass filter stages, VCOs or ZIF mixing to achieve this.  Some other revisit the analog signal conditioning and optimize the position of the sampling operation in the receive chain.  Finally some split the high speed ADC in multiple subconverters and use a DSP intensive back-end to recover the signal.  All these techniques have in common the attempt to bring the ADC as close as possible to the antenna as was envisioned by Mittola.  Leading to highly digitized architectures, not only the benefits of scaled technologies are better exploited but also the large reconfiguration capabilities of the DSP are optimally utilized.

Speakers:

• SeongHwan Cho, KAIST, “Time-based ADCs using VCOs for Digital Intensive RF Receivers”
• Andre Mariano, Atlantic Innovation ES, Bordeaux and IMS Lab, Univ. Bordeaux, “Digital Radio Architectures:  Where and How Sampling Can Be Done”
• Kimmo Koli, Nokia, “Direct DS receivers for Cellular Communications”
• Jose Silva-Martinez, Texas A&M University, “Digitally Assisted RF-to-Digital Bandpass Converters for Broadband Communication Systems”
• Theodoros Chalvatzis, Broadcom, “Delta-Sigma Digital Receivers with mm-Wave Sampling Clocks”
• Martin Snelgrove, Kapik, “Wideband Sampling by Decimation in Frequency”
• Hassan Aboushady and Nicolas Beilleau , Univ. Pierre and Marie Curie, Paris VI  and Federal Univ. Rio Grande do Norte, Natal, “RF LC Bandpass Sigma-Delta ADCs with Finite Impulse Response Feedback DACs”
• Julien Ryckaert, IMEC, “RF Bandpass Full Delta-Sigma converters in Scaled CMOS”

8:00 AM – 5:20 PM
WSH: Design for Manufacturability and Self-Testability of RFICs

Organizers:    Jaber A. Khoja, Zoran
                          Oren Eliezer, Xtendwave
                          R. Bogdan Staszewski, Delft University of Technology

Abstract:  With the increased complexity and higher level of integration in today’s mixed signal SoCs, it has become crucial for RFIC designers to minimize the production-testing costs, while also guaranteeing high production yields, by applying design-for-manufacturability (DfM) approaches early in the design phase.  The reduction in test costs and in productization costs in general is achieved through a combination of strategies that may be considered as design-for-testability (DfT) approaches, and in particular built-in self-testing (BiST).  As with the common practice in digital design, DfT in mixed-signal circuitry considers the productization- and testing-related needs during the design phase through provisions allowing for simple and low-cost characterization and testing, while also maximizing yield.  The on-chip resources for the realization of the DfT mechanisms may include existing circuitry, such as data converters that are used for various purposes during normal operation, dedicated circuits that are added for the sake of testing or calibration/compensation, and dedicated routines that may run on an on-chip processor and memory.  The DfT approach must allow for the various mixed-signal functions to be self-calibrated/compensated in accordance with the expected process variations, such that there won’t be a need to screen incompliant devices through expensive and lengthy parametric tests, also resulting in yield loss.  The workshop will present recent approaches to design and productization of RF circuitry, developed by industry leaders and academia, including many examples demonstrating the implementation of these principles in high-volume products.

Speakers:

• Jaber A. Khoja, Zoran, “The Need for Testing: Reliability, Screening and Yield Enhancement”
• Mustapha Slamani, IBM, “Production RFIC Testing”
• Mani Soma, University of Washington, “DFT and the IEEE 1149.4 Mixed-Signal Test Bus Standard”
• K.-T. Tim Cheng, Univ. of California, Santa Barbara, “Emerging Test Paradigms for Low-cost Production Testing of Analog/RF Circuits”
• Jose Silva-Martinez, Texas A&M University, “On-Chip Calibration and Novel Performance Monitoring of RF Circuits”
• Oren Eliezer, Xtendwave, “Design-for-Manufacturability in Low-Cost Mass-Volume RF SoCs”
• Stephen Sunter, Mentor Graphics, “Production Tests and BIST for ADCs and DACs”
• R. Bogdan Staszewski, Delft University of Technology, “RF-BIST in the RF-SoC Environment”

8:00 AM – 5:20 PM
WSI:  RF Bio-Medical Electronics and Sensors

Organizers:     Sayfe Kiaei, Arizona State University
Brian Otis, University of Washington

Abstract:  RFIC & Mixed-Signal Integrated Devices have found significant and multifarious applications in the broad bio-electronics and bio-medical domains over the past 30 years. Today, RFIC and Mixed-Signal systems are indispensable to the development of many imaging applications, sensors, actuators, and related products. RF sensors and analog/digital processing are critical to numerous bio-medical components, which include medical implanted devices, embedded wireless sensors in the human body, and external bio-marker sensors. This workshop will focus on the development of emerging fully integrated sensors, RF medical implanted devices, neural sensors, and relevant biomedical applications. This workshop will be a RFIC workshop with emphasis on the latest innovations in RF and Mixed-Signal processing in Bio-Electronics. The topics covered will focus on: 

• Medical Implanted Communication System (MICS)
• Bio, Molecular, and Bio-chemical Sensing
• RF Bio-imaging
• Bio Sensors and Actuators

Speakers:

• Ben Calhoun, University of Virginia,
  “System-Level Issues in Wireless Biomedical Systems”
• Patrick Chiang, Oregon State University
  “Wearable Sensor Electronics for Monitoring the Effects of Aging”
• Pedram Mohseni, Case Western University,
  “Wireless Integrated Systems for Chemical and Electrical Neural Recording: Challenges in High-Site-Density Brain Monitoring”
• Brian Otis, University of Washington,
  “Ultra-Low Power, Miniaturized RF IC for Bio-Medical Applications”
• Chris Van Hoof, Holst Centre / IMEC
  "Wireless Sensors and their System Power Optimization"
• Mohamad Sawan, Ecole Polytechnique de Montreal
  “Harvesting Energy and Bidirectional Wireless Data Transmission for Implantable BMI Applications”
• Thierry Taris, University of Bordeaux
  “Micro-W Transceivers for Bio-Medical Application”
• Stephen O'Driscoll, University of California, Davis
  “Wireless Power and Data Transfer for Implantable Medical Devices”
• Sayfe Kiaei, Arizona State University
  “Overview of Wireless Medical Implanted Device”

8:00 AM – 5:20 PM
WSJ: Systems & Circuits for Sensing, Co-Existence, and Interference Mitigation in SDR and Cognitive Radios

Organizers:    Ramesh Harjani, University of Minnesota
                          Brian Sadler, Army Research Laboratory
                          Hossein Hashemi, University of Southern California
                          Jacques C. Rudell, University of Washington

Abstract:  Cognitive Radios (CR) provide a new paradigm to improve spectrum efficiency by enabling Dynamic Spectrum Access (DSA).  In CR, spectrum holes that are unoccupied by primary users can be assigned to appropriate secondary users as long as the interference introduced by secondary users is not harmful to the primary users. In this workshop, we focus on the spectrum sensing problem in CR, in which sensing and detection of primary users is done in order to realize DSA.  Spectrum sensing can be a very challenging task for CR due to many factors.  First, the sensing bandwidth for CR can expand from hundreds of MHz to several GHz.  Second, the sensing radio should be able to detect very weak primary users, which arise due to fading and the hidden terminal problem.  Third, the receiver may need to detect a signal in the presence of a strong coexisting transmitter.  Traditional time-domain Nyquist sampling or wideband sensing are quite challenging due to bandwidth, dynamic range, power, and resolution requirements.   Alternatively, compressed sensing can be used to reduce the sampling rate, taking advantage of the sparsity of the signals in the frequency domain.  Spectrum sensing requires reliable signal detection in negative SNR regime within a constrained sensing time. Signal processing algorithms for very low SNRs in a noise dominated regime are quite different from demodulation and detection processing in conventional digital communications.
This full day workshop consists of 9 talks.  The morning sessions will focus on motivation and the many system aspects of cognitive radios and Dynamic Spectrum Analysis.  The afternoon presentations in this workshop will focus on potential implementation issues surrounding highly-integrated CMOS transceivers characterized by a high degree of programmability, low noise, high dynamic range receivers and transmitters for CR applications.  Whenever possible and appropriate, measurements from actual designs will be used to supplement the theoretical understanding of workshop participants.

Speakers:

• Preston Marshal, University of Southern California, “Interference Tolerance as a New Principle for Spectrum Policy and Technology”
• Brian Sadler, Army Research Laboratory, “Shared Spectrum: An Overview of Sensing and Processing”
• Mark McHenry, CTO, Shared Spectrum , “Dynamic Spectrum Access Software Design”
• Danijela Cabric, University of California, Los Angeles, “Signal Processing Approaches for Spectrum Sensing: Theory and Implementation”
• Sebastian Hoyos, Texas A&M University, “Mixed-Signal Parallel Compressive Spectrum Sensing for Cognitive Radios”
• Larry Larson, University of California, San Diego, “RF Circuit Implementation Issues of Cognitive and Software Defined Radios”
• Bram Nauta, University of Twente, The Netherlands, “Wideband and Interferer Robust Software Defined Radio in CMOS”
• Jan Craninckx, IMEC, Leuven, “Transceiver Design for Interference-Robust Software-Defined Radios”
• Ranjit Gharpurey, University of Texas, Austin, “Design Challenges in Radios for Emerging Broadband Wireless Systems”

1:20 PM – 5:20 PM
WSK: Efficiency Enhancement Techniques of Power Amplifiers and Transmitters for Mobile Applications

Organizers:    Youngwoo Kwon, Seoul National University
                          Nick Cheng, Skyworks Solutions

Abstract: With the proliferation of data services and smart phones, mobile phone manufacturers are faced with new, unprecedented challenges and demands from both mobile operators and consumers.  In particular, “thermal issues” and “battery life” are two major challenges related to the transmitter section of the phone.  For example, excessive current consumption of the power amplifiers often results in the overheating of the mobile devices, the solution of which may even affect the industrial design of the phones.  The added features in the smart phones and the extensive data usage call for the frequent recharges on the battery, which is extremely inconvenient from the users’ point of view.  Thermal and battery issues will become increasingly difficult to solve at the phone level as the industrial design gets more complex and the data rates continue to increase. The efficiency improvement of the power amplifiers and transmitters is the only solution to address these concerns. 
Presentations in this workshop will focus on the novel design techniques to enhance the efficiencies of the transmitters and power amplifiers.  The workshop will start with the discussions on front-end topologies to improve the overall transmitter efficiency, and move on to a hot topic of “envelop tracking”, which has the potential of proliferation into the handset applications.  Ever-growing interest in the CMOS PA’s will also be covered with two presentations with a special focus on the design techniques to overcome the linearity and efficiency limitations of the CMOS devices.  Both wireless LAN and 2G/3G applications will be covered.

Speakers:

• James Young, Skyworks Solutions, “Front End Topologies and PAE Enhancement Techniques”
• Don Kimball, University of California, San Diego, “Highly Efficient RF Front End Using Envelope Tracking Techniques”
• Donald Lie, Texas Tech University, “Design of Si-Based High-Efficiency RF Power Amplifiers and Polar Transmitters for Mobile Broadband Wireless Communications”
• Songcheol Hong  , KAIST, Korea, “RF CMOS PAs for Mobile Communications”
• Ali Afsahi, Broadcom, “High Power, Highly Linear CMOS Power Amplifier for WLAN Applications”